PicoStation3D光学轮廓仪应用于半导体先进封装3D检测

PicoStation多模式3D光学轮廓仪应用于半导体先进封装3D检测，通过高速压电扫描和GPU并行图像计算，最快几百毫秒即可获取芯片表面形貌数据，用以计算台阶高度、表面粗糙度和翘曲度等。

PicoStation Multi-Mode 3D Optical Profiler is designed for advanced semiconductor packaging 3D inspection. Leveraging high-speed piezoelectric scanning and GPU-based parallel image processing, it can capture chip surface topography data in as little as a few hundred milliseconds, enabling precise calculations of step height, surface roughness, and warpage.